Dry - Wet Processing Technologies for Large Area Electronics

Dry Processing Technologies for Large Area Electronics

http://innolae.org/dry-processing-technologies/

The Dry Processing Short Course is delivered by the Centre for Process Innovation (CPI). It covers the key processing techniques required for large area electronic device manufacture, including vacuum deposition, photolithography, laser ablation and wet and dry etching. In each case the advantages, disadvantages and technological challenges of each technique will be covered, along with issues arising in scale up for manufacture.

MONDAY 20 JANUARY 2020

12:30 – 13:30 Registration
13:30 Course begins


Dry Processing (Thin Film Fabrication and Patterning)
Vacuum Deposition
Dr Andrew Cook, CPI

Physical vapour deposition
Chemical vapour deposition
Description of evaporation process
Description of sputtering process
Comparison of evaporation vs sputtering
PVD chamber design
Requirements for a process chamber
Discussion on vacuum pumps types
Discussion on power supplies
PVD process conditions
Pressure, time & power vs deposition rate & thickness
Magnetron sputtering
Metal vs reactive sputtering
Target types

Description of ALD process
ALD cycle
Temporal vs spatial ALD
Current tool types


Photolithography Processes
John McLean, CPI

Photo processes
Positive and negative resists
Lift off resists
Image reversal resists
Cured dielectrics
Hard mask process
UV-NIL
Photo tool set
Spin Coating
Alignment
Maskless photolithography
Developing photoresist
Common issue considerations
Resist adhesion
Reflectivity of the material or underlying material
The planarity of the material
Etch characteristics of the material
Resist removal method
Thermal stability of sublayers and deposited material
Exposure factors-

14:50 - 15:20 Coffee break

Laser Processing for Ablation and Patterning
John McLean, CPI

Etching Processes

Mike Clausen, CPI

Differences between wet and dry etching
Isotropic versus anisotropic
Typical wet etch chemistries
Typical wet etch problems
Plasma etch fundamentals
Selectivity, etch rate, uniformity
Steps in a plasma etch process
Typical plasma chemistries
Integration


Mike Clausen, CPI

Brief overview of the CPI integration facility
Case studies
17:00 Course ends

Dr Andrew Cook, Senior Scientist
CPI, UK
Dr Andrew Cook gained his PhD in physical organic chemistry. He has worked in the fields of polymer synthesis and industrial scale roll to roll vacuum coating technologies (primarily sputtering, thermal evaporation and atomic layer deposition). Andrew’s background is in synthetic organic and organometallic chemistry from mg to kg scale, and is very competent with all modern analytical measuring and identification techniques. Andrew has a proven publication track record and has worked across multi collaborative research & development projects funded by IUK and the European Union, most notably Fabrigen, HiBPE and R2R CIGS, which have directly investigated the scaling up of technologies to manufacturing readiness levels.



John McLean, Process Engineering Team Leader
CPI, UK
John McLean is the Process Engineering Team Leader within CPI Electronics. He started his working life in 1986 with National Semiconductor and has mainly worked within the semiconductor industry since. He has worked for a number of large companies like Siemens and Atmel as well as smaller companies in his capacity as a process engineer. For the last seven years he has been at CPI as part of the process engineering team. John has primarily been involved in photolithography and patterning, from contact aligners to deep UV scanners. John has also worked in defect engineering and metrology.



Mike Clausen, Head of Technology
CPI, UK
Mike Clausen is the Head of Technology within CPI’s Electronics unit. He is responsible for providing technical leadership, developing technologies so that they can be translated to innovative products capable of commercialization in the future. Previously, he was responsible for developing the knowledge base and technology assets for the optoelectronics sector, in addition to delivering technology programmes from concept through to innovation. Mike has 25 years experience within the electronics field working within research and development, mass production and customer service environments. He has worked for medium size British companies and major international blue chip organisations such as Fujitsu Microelectronics, NXP, Filtronic Compound Semiconductors and RFMD. His knowledge base spans operations management, process engineering and integration, technology development, yield enhancement and project management.



Wet Processing Technologies for Large Area Electronics
http://innolae.org/wet-processing-technologies-for-large-area-electronics/
The Wet Processing Short Course is delivered by Printed Electronics Ltd (PEL) and the Centre for Process Innovation (CPI). It covers the inks and printer technology required for deposition techniques including screen, inkjet and flexo/gravure printing. The short course also covers coating techniques such as doctor blade and slot die, drawdown, spin and spray coating. In each case the advantages, disadvantages and technological challenges of each technique will be covered, along with issues arising in scale up for manufacture

COURSE OUTLINE

MONDAY 20 JANUARY 2020

08:00 – 09:00 Registration

09:00 Course begins

Wet Processing (Formulation, Coating and Printing)
PEL and CPI

Materials and Formulation
Nicola Broughton, CPI

Inks
Silver, copper, carbon and other ink materials
Formulation
Rheology
Solvent-based inks
Curable inks
Ink formulation components
Mixing and scale-up
Substrates
Polymers, glass, paper, textiles and metals
Printing
Dr Neil Chilton, Printed Electronics Limited (PEL)

Inkjet
Screen print
Other print technologies such as flexography, gravure etc.
11:00 - 11:30 Coffee break

Large Area Coating Methods
Nicola Broughton & Dr Rob Valentine, CPI

Batch coating
Drawdown and dip
Spin coating
Continuous processes
Doctor blade
Spray coating
Slot die
Scale-up for continuous processes
Applications of large area coating
12:30 Course ends

Nicola Broughton, Senior Scientist
CPI, UK

Nicola is a Senior Scientist working on collaborative and commercial research projects in the field of printable electronics. With a background in cell biology, Nicola has worked as an industrial laboratory chemist developing new products and formulations for an aerosol manufacturer. At CPI Nicola has worked to develop functional ink formulations, particularly those containing nanomaterials. She also works to establish coating, printing and curing methods for a number of different applications including IoT enabled devices, wearable electronics and sensors.



Dr Rob Valentine
CPI, UK

Dr Rob Valentine graduated from University of Durham with an MChem before undertaking a PhD at the University of Edinburgh in the Synthesis and Characterisation of Novel Organic Electronic Materials. Following these postgraduate studies Rob joined CPI in 2012 where he has been ever since. During his time at CPI Rob has developed particular expertise in a range of topics including OTFT, Photovoltaics and Sensor Technologies covering areas such as material formulations, deposition techniques and device architecture.



Dr Neil Chilton, Technical Director
Printed Electronics Limited, UK

Neil has more than twenty years’ experience in the field of electronics and electronic components. After completing his BSc and PhD in Physics, his technical career took him to Japan where he worked for four years at the advanced materials research division of Nippon Steel Corporation. After returning to the UK he joined Europe’s then largest printed circuit board manufacturing company where he was later part of an MBO team and technical director. In 2006, together with co-founder Dr Steve Jones, he started Printed Electronics Limited to focus on the practical use of inkjet for manufacturing electronic interconnects, devices and systems

Short courses
Wet processing technologies for large-area electronics
Dry processing technologies for large-area electronics
Short course registration

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